Extended Heatpipe

A heatpipe redistributes heat across the MOS heatsinks to the chipset heatsink for expanded thermal dissipation

DDR4 BOOST WITH STEEL ARMOR

Isolated memory circuits, shielded DIMM slots, and extensive compatibility testing

IR Digital PWM

IR digital power, DrMOS, and titanium choke II lets the system run reliably even under extreme conditions

Core Boost Technology

Dual 8-pin CPU power connectors and optimized power circuits let ACE unleash maximum performance

Wi-Fi 6 & Bluetooth

Featuring the latest wireless solution, delivering speeds up to 2400Mbps and supports MU-MIMO and BSS color technology

Flexible Network Solution

Onboard 2.5G LAN and Gigabit LAN

Frozr Heatsink Design

The X570 chipset, with its PCI-E Gen4 capabilities, is actively cooled to sustain massive data bandwidth

Server-Grade PCB

Server-grade PCB fully supports the high bandwidth and fast transfer speeds of PCI-E Gen 4

TRIPLE TURBO M.2 & M.2 SHIELD FROZR

Sustain maximum high-speed M.2 SSD data transfer with M.2 SHIELD FROZR and prevent SSD thermal throttling with a heatsink

Multi-GPU support & PCIe Steel Armor

Supports NVIDIA SLI and AMD CrossFire

Zero Frozr Technology

Fan speed is automatically controlled and can power down temporarily in low-load situations to produce no fan noise